Eurasia Packaging 2014
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Teknointel, participated with a large booth to Eurasia Packaging Exhibition 2014  on 18-21 September in TUYAP.

PW Lenzen,Robopac,Sacmi Packaging, Proyecma ve Ravizza Packaging participated with their own areas in our booth.

Many customers visited our booth and a lot of important business connections and networks are obtained.