Our participation to Eurasia Packaging Exhibition 2013
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Teknointel is participating to the Eurasia Packaging 2013 fair with a 85 m2 stand .

We invite all of our customers and friends to our stand in Hall 2 Stand no. 1143 .

This year the following of our principals are participating to our stand.

  Lenzen

  Robopac/Aetna

  Mobert

  Rofin,

  Grandi,

 OMV

Please contact us for free invitation cards.