Our participation to Eurasia Packaging Exhibition 2013
Teknointel is participating to the Eurasia Packaging 2013 fair with a 85 m2 stand .
We invite all of our customers and friends to our stand in Hall 2 Stand no. 1143 .
This year the following of our principals are participating to our stand.
Lenzen
Robopac/Aetna
Mobert
Rofin,
Grandi,
OMV
Please contact us for free invitation cards.